NXP Articles
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010.
- Written by Super User
- Parent Category: Product News
- Category: NXP Articles
- Published on Monday, 28 May 2012 08:06
- Hits: 330
Upload to the good news in the the EEPW the year 2011 power supply technology and products Award "Presentation Ceremony May 25, 2012, NXP Semiconductors products GreenChip power supply IC TEA1716 the SPR in the fierce competition, won the Best Award" for "green power. Power technology and product awards EEPW ("One of the important events annually organized by the Electronic Product World magazine), has so far successfully organized many sessions. The selection each year to the global power products manufacturers on a regular basis collecting outstanding products released in the past year, to vote by the expert review and users taken into account the final named its award-winning products enjoy a high reputation and authority in the industry.
NXP, The GreenChip the SPR the TEA1716 switch mode power supplies (SMPS) controller IC is the industry's first PFC and LLC resonant combination of controllers, to achieve ultra-low standby power consumption under low load, and in line with the EU eco-design directive will take effect in 2013 requirements. This intelligent power resonance (SPR) TEA1716 controller specifically designed for 90W to 500W power supply in SO24 package seamlessly integrates PFC and resonant half-bridge controller (HBC). With less than 150 mW no-load power and the universal power of 91% average efficiency, the TEA1716 standby efficiency, a new standard, is currently on the market only a load of about 250 mW standby power consumption is far much lower than the the 0.5W modular controller in full compliance with the EU Energy products Directive (EuP) Lot 6 requirements.
- Written by Super User
- Parent Category: Product News
- Category: NXP Articles
- Published on Friday, 11 May 2012 04:40
- Hits: 314
NXP Semiconductors has introduced the industry's first high performance I2C bus controller, the controller can also support fast mode Plus (Fm +) and the new super-fast mode (UFm) specifications, new specifications to send data transfer rate up to up to 5 Mb / s. PCx966x range of products for each channel to provide 4.25 super-kB data cache, can significantly reduce host processor interrupt specific repeatability, data-intensive LED controller and the stepper motor (such as the gaming industry) the application of efficient I2C design optimization.
I2C bus NXP (formerly Philips Semiconductor) invented 30 years ago, an intuitive and powerful serial structure based on a simple two-wire format to replace the complexity of the parallel interface chip to chip communication with to revolutionary change. I2C bus continues to be widely used in the computing and enterprise system management and control, as well as portable and consumer applications, because it can reduce IC footprint, thereby reducing system cost. The new ultra-fast mode (UFm) rate up to 5 MHz, a one-way push-pull serial bus, very suitable for the LED driver does not require feedback controllers and other devices. With the UFM and Fm + bus controller, NXP improve the management of large and complex data transfer, improved the ability of the anti-electric shock, which greatly enhances the the I2C performance of the Japanese pachinko slot machines and other gaming systems.
Positive evaluation of
• NXP's interface products, international product marketing manager Stephen Blozis said: "durability excellent solution for a class of professional games like pachinko and slot machines can reduce the host processor to interrupt the case, to achieve very fast, complex, large-scale data transmission. supports ultra-fast and fast-mode Plus I2C-bus controller, through the introduction of NXP to meet the growing needs of this market is always in the forefront. our new UFm bus control can handle up to 5 Mb / s data transmission, will greatly enhance the performance of advanced gaming systems, and provide a new framework for large LED displays. "
Facts / Highlights:
PCx966x I2C bus controller design advantages include:
• Easy programming of microcontrollers to achieve repeatability, data-intensive applications
• large-scale data transmission allows the system microcontroller interrupt to reduce at the same time to speed up the loading cycle
• Use a serial sequence can be achieved up to 64 slave communication
• Support for JTAG boundary scan
The new I2C UFm and Fm + technical characteristics include:
• from the parallel bus to I2C bus protocol converter and interface
• 5 Mb / s unidirectional data transmission with push-pull totem pole output channel of the ultra-fast mode (UFm)
• Use open-drain output in the fast-mode Plus (Fm +) channel 1 Mb / s bidirectional data transfer
• Each channel has 4,352 byte cache
• Serial-loop control function supports automatic re-launch the saved sequence
• Trigger input to the serial communication with external events fully synchronized
- Written by Super User
- Parent Category: Product News
- Category: NXP Articles
- Published on Monday, 07 May 2012 04:23
- Hits: 313
NXP Semiconductors NV today announced a new SOT1226 "Diamond" package, which is the world's smallest universal logic package, with a unique design of the pad spacing. New SOT1226 size of only 0.8 x 0.8 x 0.35-mm leadless plastic package, the volume is smaller than the previous world's smallest logic package NXP SOT1115, 25%.
Although the size is smaller, but the SOT1226 pad pitch of 0.5-mm, 50% higher than before, so that the welding easier, saves time and costs for engineers. The package is ideal for the design of cutting-edge portable devices such as smart phones, PCB space is very key to this type of design. The Diamond package shape is unique, space-saving logic solutions, enabling the device to minimize manufacturing costs related to the smaller pad spacing mode and does not increase.
The typical package manufacturing process using 0.3-mm or 0.35-mm pad pitch, the electronics manufacturing services (EMS) using the step-down mask in order to successfully install the device on the PCB and packaging factory. The diamond package with a larger pad spacing (up to 0.5-mm), using the step-down mask is no longer needed in the welding process, cost savings for manufacturers. In addition, the larger pad pitch of the Diamond package provides a greater degree of exposure to space, so that the component layout is easier, and also increased the bond strength and stability, while reducing short-circuit risk. The larger pad pitch PCB packaging to avoid some costly mistakes, such as bridging or contact form accidental bridging, such errors may lead to electrical equipment can not be used.
NXP Semiconductors Logic, director of marketing: Kristopher Keuser, mobile device designers often face the challenge of adding more functionality in smaller portable device space, which in turn lead to new challenges. NXP's new The Diamond package is a change the rules of the game's solution, does not increase the manufacturing cost of the premise, so that our customers can be smaller geometric space carried out design, and be able to achieve customer throughout the product combination of standardization. the product highlighting the NXP pump for a commitment to lead the industry in innovation and understanding of the market, smaller, cheaper and more reliable solution is the driving force of the market. "
50-year History of Logic: to promote the miniaturization trend
NXP has always been committed to the logic of market development, for investment in new technology and new packaging technology and packaging facilities, to provide cutting-edge products. In the past 50 years, the business of NXP logic - from Signetics and Philips Semiconductors - to meet growing worldwide demand for logic products. As the world's largest shipments suppliers, NXP supports the largest bulk of the logic of product demand, while providing a wide variety of industry-leading packaging solutions.
Feature
5-pin package
· 0.8 x 0.8 x 0.35 mm
· 0.5 mm pitch
· World's smallest package with the universal low-voltage CMOS (LVC) and ultra low power (the AUP) CMOS logic functions
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